SK Hynix is set to showcase its advanced high-bandwidth memory (HBM) technologies at CES 2025, the world’s largest consumer electronics show, scheduled from January 7 to 10 in Las Vegas. The company will present its vision as a “full-stack AI memory provider.” SK Hynix will unveil its 5th generation HBM3E 16-stack prototype following its achievement of mass-producing HBM3E 12-stack products.
At CES 2025, SK Hynix will highlight solutions optimized for on-device AI and next-generation AI memories, including its representative AI memory products such as HBM and SSD.Â
The company will also run a joint exhibition booth with other SK Group affiliates, including SK Telecom and SK Enmove, under the theme “Innovative AI, Sustainable Tomorrow.” SK Hynix aims to demonstrate its technological competitiveness and further solidify its position in the AI memory sector through this participation.
At CES 2025, SK Hynix will also highlight its breakthrough 16-layer HBM3E product, which features the highest capacity of 48 gigabytes and the most advanced stack configuration with 16 layers. This new memory solution, first revealed in November 2024, has been developed using an innovative mass reflow-molded underfill (MR-MUF) process.Â
This technique allows the company to achieve a 16-layer stack while minimizing chip warpage and enhancing heat dissipation performance. SK Hynix aims to begin certification procedures for this product in the first half of 2025 and expects its yield to meet the standards of the 12-layer HBM3E, which is currently in mass production.
In addition to the HBM3E, SK hynix will also display its high-performance enterprise SSDs, such as the 122TB D5-P5336, developed by its subsidiary Solidigm. Designed for AI-powered data centers, this SSD stands out for its exceptional power efficiency and space optimization. By offering a well-rounded portfolio of memory and storage solutions, SK hynix aims to create synergies and better address the increasing demand in the high-capacity SSD market.
In addition to its memory products, SK Hynix will introduce several next-generation technologies at CES 2025, including Compute Express Link (CXL) and Processing in Memory (PIM) technologies.Â
The company will also display modularized versions of these technologies, such as the CMM (CXL Memory Module)-Ax and AiMX5, designed to become the core infrastructure for next-generation data centers. The CMM-Ax, in particular, is a product that combines computational functionality with the ability to expand high-capacity memory, improving both performance and energy efficiency for server platforms.
The exhibition will also feature solutions tailored for on-device AI applications, with products such as the LPCAMM2 and ZUFS, which enhance data processing speed and power efficiency for edge devices like smartphones and PCs.Â
