SK Group Chairman Chey Tae-won is in Taiwan this week, accompanied by SK Hynix CEO Kwak Noh-jung, as part of an official visit to strengthen the group’s ties with Taiwan Semiconductor Manufacturing Co. (TSMC). The trip comes at a time of rising global uncertainty in semiconductor supply chains and amid mounting US tariff pressures.
According to multiple industry sources, SK Group Chairman Chey Tae-won and SK Hynix CEO Kwak Noh-Jung arrived in Taiwan on Wednesday and held a closed-door meeting with executives from Taiwan Semiconductor Manufacturing Co. (TSMC). The visit is closely tied to the upcoming mass production of SK Hynix’s next-generation HBM4 AI memory chips, incorporating TSMC’s advanced base die technology. Chey’s itinerary also included meetings with other leading Taiwanese tech firms, such as ASUSTeK Computer Inc. and Wistron Corp.
This trip marks Chey’s first visit to Taiwan since June last year, when he met with TSMC Chairman C.C. Wei to discuss expanding collaboration in developing high-bandwidth memory (HBM) technologies. Their renewed partnership is seen as crucial for advancing HBM4, the sixth generation of memory chips, which SK Hynix and TSMC are jointly developing. Mass production of HBM4 is scheduled to begin in the second half of 2025.
TSMC will supply the logic base dies for HBM4, a critical layer that processes and routes data within the memory stack. While SK Hynix used in-house technology for base dies up to HBM3E, it is now shifting to TSMC’s advanced processes to integrate more functions into smaller chip areas, optimizing performance for AI applications.
SK Hynix delivered the world’s first 12-layer HBM4 samples to clients, including Nvidia, ahead of schedule in March. With the highest bandwidth and capacity currently available, the chip further solidifies SK Hynix’s lead in the HBM market. Industry watchers believe this strengthens the tripartite relationship among SK Hynix, TSMC, and Nvidia in the ongoing race for AI chip supremacy.
The timing of Chey’s visit is particularly significant given the growing geopolitical tensions and protectionist trade policies affecting global chip supply chains. Taiwan remains a central player in the semiconductor industry, not only as TSMC’s base but also as home to numerous essential tech manufacturers. Chey has emphasized the importance of leveraging SK Group’s broad capabilities—from semiconductors to data centers—to overcome AI challenges and accelerate global innovation.
Chey Tae-won’s visit to Taiwan comes amid escalating global trade tensions, particularly due to the tariff policies imposed by the United States under former President Donald Trump.
Industry experts speculate that SK Hynix may be seeking to mitigate potential shocks from heavy US tariffs on chip imports by strengthening its partnership with TSMC. Taiwan, home to major semiconductor players like Foxconn and Wistron, remains a key hub in the global AI chip value chain, making the visit strategically important for SK Hynix.
In line with its growing focus on AI and HBM technologies, SK Hynix will showcase its latest HBM4 chips and advanced packaging solutions at the upcoming TSMC Technology Symposium in Santa Clara, California, on April 23. This annual event gathers TSMC’s key partners and serves as a platform for unveiling next-generation chip designs and system innovations. Last year, SK Hynix introduced its HBM3E chip at the symposium, further highlighting the importance of its continued collaboration with TSMC in maintaining its competitive edge in the memory chip market.
