SK Hynix, the world’s second-largest memory chip manufacturer, has announced the development of the industry’s first 16-gigabyte DDR5 chip using sixth-generation 10-nanometer technology. This new DRAM chip, unveiled on Thursday, has several advancements over its predecessors, including enhanced cost competitiveness and a productivity boost exceeding 30 percent through design improvements.
The new 16GB DDR5 chip from SK Hynix has achieved an 11 percent increase in operating speed and a more than 9 percent improvement in power efficiency, making it particularly suitable for high-performance data centers.
The enhanced DRAM is expected to help these centers reduce electricity costs by up to 30%, addressing the rising power demands associated with advancements in artificial intelligence. The chip is set for mass production later this year, with volume shipments expected to begin next year.
Kim Jong-hwan, head of SK Hynix’s DRAM development, emphasized the company’s plans to deliver exceptional performance and cost efficiency with its new 1c technology. “We are committed to providing differentiated values to customers by applying the 1c technology equipped with the best performance and cost competitiveness to our major next-generation products,” Kim said. This focus on innovation aims to provide value to customers through the latest generation of memory products.
In addition to the DDR5 chip, SK Hynix is preparing to start full-scale production of its next-generation GDDR7 graphics memory chip in the third quarter of this year. The GDDR7 chip features a notable 60 percent improvement in speed, reaching 32 gigabits per second, and can process over 1.5 terabytes of data per second—equivalent to around 300 full-HD movies.
The new DDR5 chip from SK Hynix also has over a 50 percent improvement in power efficiency compared to its predecessor. This enhancement is achieved through advanced packaging technology that effectively manages the heat generated by the chip’s ultra-fast data processing capabilities. Such improvements are crucial for maintaining performance while addressing thermal challenges.
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